-
1 metallization masking
маскування для формування сполучної металізаціїEnglish-Ukrainian dictionary of microelectronics > metallization masking
-
2 masking
1) маскування 2) літографія - dry masking
- metallization masking
- nitride masking
- optical masking
- oxidation masking
- oxide masking
- photo masking
- photoresist masking
- projection masking
- reticle masking
- selective photoresist masking
- selective masking
- silicon-dioxide masking
- wet masking -
3 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
-
4 level
1. ім.1) рівень2) ступінь (напр. інтеграції)2. дієсл. вирівнювати, розрівнювати - acceptor energy level
- algorithmic level
- allowed level
- automation level
- behavioral level
- chip complexity level
- chip level
- circuit level
- circuit complexity level
- complexity level
- concentration level
- confidence level
- damage level
- dc level
- deep level
- defect level
- degenerate level
- discrete energy level
- discrete level
- donor energy level
- doping level
- dynamic level
- electrical level
- electron quasi-Fermi level
- empty level
- filled level
- functional level
- functionality level
- gate level
- hole quasi-Fermi level
- impurity level
- input level
- integration level
- interconnection level
- logic level
- logical one level
- logical zero level
- logic gate level
- mask level
- masking level
- metallization level
- noise level
- occupied level
- register transfer level
- resistivity level
- saturation level
- shallow level
- sheet-resistance level
- steady-state level
- submicron level
- superficial level
- switch level
- transistor switch level
- trapping level
- TTL level
- two-resist level
- unfilled level
- unknown logic level
- vacant level
- wafer level -
5 pattern
1. ім.1) малюнок; зображення; образ; рельєф2) конфігурація, форма2. дієсл. формувати малюнок; формувати зображення; формувати рельєф; структурувати - chip pattern
- circuit pattern
- computer-generated pattern
- conductive pattern
- conductor pattern
- contact pattern
- contiguous-disk propagation pattern
- customized metallization pattern
- discretionary wiring pattern
- dislocation pattern
- domain pattern
- dopant pattern
- electron-beam pattern
- electron diffraction pattern
- emitter pattern
- error-free layout pattern
- etchedpattern
- etchpattern
- fine-line pattern
- fine-linewidth pattern
- fixed-interconnection pattern
- gate pattern
- geometric pattern
- growth pattern
- high-aspect ratio pattern
- insulation pattern
- integrated-circuit pattern
- interconnection mask pattern
- layout pattern
- lead pattern
- mask pattern
- masked реrmalloy pattern
- masking pattern
- master pattern
- measurement pattern
- metal-finger pattern
- multiple pattern
- optical pattern
- oxide pattern
- permalloy propagation pattern
- photographic emulsion-maskpattern
- photographic emulsionpattern
- photoresist film pattern
- photoresist pattern
- photoresist mask pattern
- process evaluation and control pattern
- programmed-interconnection pattern
- regular pattern
- repetitive pattern
- reticle pattern
- routing pattern
- shifting test pattern
- silicon pattern
- step coverage pattern
- striation pattern
- subisolation pattern
- sunken охide pattern
- surface relief pattern
- test pattern
- thick-film pattern
- thin-film pattern
- transistor pattern
- wafer pattern
- wiring pattern
См. также в других словарях:
metallization masking — metalizavimo maskavimas statusas T sritis radioelektronika atitikmenys: angl. metallization masking vok. Maskierung für Metallisierung, f rus. маскирование для металлизации, n pranc. masquage pour métallisation, m … Radioelektronikos terminų žodynas
Maskierung für Metallisierung — metalizavimo maskavimas statusas T sritis radioelektronika atitikmenys: angl. metallization masking vok. Maskierung für Metallisierung, f rus. маскирование для металлизации, n pranc. masquage pour métallisation, m … Radioelektronikos terminų žodynas
masquage pour métallisation — metalizavimo maskavimas statusas T sritis radioelektronika atitikmenys: angl. metallization masking vok. Maskierung für Metallisierung, f rus. маскирование для металлизации, n pranc. masquage pour métallisation, m … Radioelektronikos terminų žodynas
metalizavimo maskavimas — statusas T sritis radioelektronika atitikmenys: angl. metallization masking vok. Maskierung für Metallisierung, f rus. маскирование для металлизации, n pranc. masquage pour métallisation, m … Radioelektronikos terminų žodynas
маскирование для металлизации — metalizavimo maskavimas statusas T sritis radioelektronika atitikmenys: angl. metallization masking vok. Maskierung für Metallisierung, f rus. маскирование для металлизации, n pranc. masquage pour métallisation, m … Radioelektronikos terminų žodynas
Application-specific integrated circuit — An application specific integrated circuit (ASIC) is an integrated circuit (IC) customized for a particular use, rather than intended for general purpose use. For example, a chip designed solely to run a cell phone is an ASIC.In contrast, the… … Wikipedia
Ferroelectric RAM — (FeRAM or FRAM [FeRAM is the accepted generic acronym for ferroelectric random access memory.] ) is a random access memory similar in construction to DRAM but uses a ferroelectric layer instead of a dielectric layer to achieve non volatility.… … Wikipedia
nanotechnology — /nan euh tek nol euh jee, nay neuh /, n. any technology on the scale of nanometers. [1987] * * * Manipulation of atoms, molecules, and materials to form structures on the scale of nanometres (billionths of a metre). These nanostructures typically … Universalium
